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Metal and Metal alloy Sputtering Target

Additional information

Purity

99% to 99.9999%

Density

95% to 99.99%

Grain Size

5um to 1000um

Design

Monolithic or with Backing Plate/ Tube

Shape

Circular(6inch to 12inch), Rectangle, Rotary.

Product Introduction

Rewin offers wide range of Metal and Metal alloy Sputtering Target a by its strictest quality control, multiplex production technologies development for the industry/Market of Semiconductor logic IC, TFT-LCD, OLED, Photomask Blank, Touch Panel, DRAM Devices, MRAM, ReRAM Devices and Radio Frequency Filter(BAW), Resistor film.

Product Portfolios are below

Co Target

Hf Target

Ni-Cr-Si Target

Cr-Si Target

Cr Target

Ta Target

Cu alloy Target

Al alloy (Al-Cu, Al-Si, Al-Sc, Al-Ti)Target

Mn Alloy Target

Fe Alloy Target

Co Fe B Target

Ti Target

Si Target

Mo Target

La Target

W Target

Carbon Target

Ru Target

Ag Target

Te Target

As2Se3 and Se Alloy Target

 

Purities/compositions &Density are subject to Discussion.

Send A Request or Inquiry

We will contact you as soon as possible, please pay attention to the email with the suffix “@rewinmc.com”